HPF0805
Features
‧Suitable for lead free soldering. ‧patible with flow and reflow soldering
- Applications
‧Consumer Electronics ‧SMPS, M/B ‧Portable Device
- Configuration
‧Measurement instrument ‧Electronic equipment
- Dimensions
- Power Derating Curve
Size 0402 0603 0805 1206
2010 2512
L 1.00±0.05 1.60±0.10 2.00±0.10 3.10±0.10 3.10±0.10 5.00±0.20 6.40±0.20
W 0.50±0.05 0.80±0.10 1.25±0.10 1.60±0.10 2.60±0.10 2.50±0.20 3.20±0.20
CDT 0.20±0.10 0.25±0.10 0.35±0.05 0.30±0.20 0.30±0.20 0.45±0.15 0.40±0.20 0.40±0.20 0.50±0.15 0.50±0.25 0.50±0.25 0.60±0.15 0.50±0.20 0.50±0.20 0.55±0.10 0.60±0.25 0.60±0.25 0.55±0.10 0.60±0.25 0.60±0.25 0.60±0.10
100 80 60 40 20
0 -55
0 70 125 155
Ambient Temperature
Maximum dissipation in percentage of rated power as a function of the ambient temperature.
. 1/6
THICK FILM CHIP RESISTORS HIGH POWER
- Rating
HPF SERIES
Type
Powe...
