Download the BZX84C47 datasheet PDF.
This datasheet also covers the BZX84C2V4 variant, as both devices belong to the same plastic-encapsulate diodes family and are provided as variant models within a single manufacturer datasheet.
Key Features
Planar Die Construction. 350mW Power Dissipation Zener Voltages From 2.4V - 39V Ideally Suited For Automated Assembly Prcesses
Plastic-Encapsulate Diodes
BZX84C series
SOT-23
Maximum Ratings (TA=25 unless otherwise noted)
Characteristic
Symbol
Forward Voltage (Note 2) @ IF = 10mA
VF
Power Dissipation(Note 1)
PD
Thermal Resistance, Junction to Ambient Air
RθJ
Operating and Storage Temperature Range
Tj,TST
Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas.
Full PDF Text Transcription for BZX84C47 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
BZX84C47. For precise diagrams, and layout, please refer to the original PDF.
ZENER DIODES FEATURES Planar Die Construction. 350mW Power Dissipation Zener Voltages From 2.4V - 39V Ideally Suited For Automated Assembly Prcesses Plastic-Encapsulate D...
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V Ideally Suited For Automated Assembly Prcesses Plastic-Encapsulate Diodes BZX84C series SOT-23 Maximum Ratings (TA=25 unless otherwise noted) Characteristic Symbol Forward Voltage (Note 2) @ IF = 10mA VF Power Dissipation(Note 1) PD Thermal Resistance, Junction to Ambient Air RθJ Operating and Storage Temperature Range Tj,TST Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2 self-heating effect 3. f=1KHZ Value Unit 0.9 V 350 mW 357 /W -65~ +150 2. Short duration test pulse used to minimize GUANGDONG HOTTECH INDUSTRIAL CO,. LTD.
BZX84C47 Datasheet
