Hewlett-Packard HMPP3890
The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance.| Part No. | HMPP3890 |
|---|---|
| Datasheet | HMPP3890 Download |
| Manufacturer |  Hewlett-Packard |
| Description | MiniPak Surface Mount RF PIN Switch Diodes |
| Buy | Stock & Price |
FEATURES
● Surface mount MiniPak package – low height, 0.7 mm (0.028") max. – small footprint, 1.75 mm2 (0.0028 inch2)● Better thermal conductivity for higher power dissipation
DESCRIPTION
/APPLICATIONS
These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes.● Single and dual versions
● Matched diodes for consistent performance
● Low capacitance
● Low resistance at low current
● Low FIT (Failure in Time) rate*
● Six-sigma quality level * For more information, see the Surface Mount Schottky Reliability Data Sheet. DataShee DataSheet4U.com Note that Agilent’s manufacturing techniques assure that dice packaged in pairs are taken from adjacent sites on the wafer, assuring the highest degree of match.
