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HSMD-H670 Datasheet PDF

Hewlett-Packard HSMD-H670

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. The HSMX-H670 and HSMX-H690 are available in four colors.
Part No. HSMD-H670
Datasheet HSMD-H670 Download
Manufacturer
Hewlett-Packard
Description Surface Mount Flip Chip LEDs
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HSMD-H670 datasheet page 1 preview

FEATURES

● Improved Reliability Through Elimination of Internal Wire Bond
● -40 to 85°C Operating Temperature Range
● Small Size
● Industry Standard Footprint
● Diffused Optics
● Compatible with IR Solder Process
● Four Colors Available
● Available in 8 mm Tape on 7" (178 mm) Diameter Reels

APPLICATIONS

● Keypad Backlighting
● LCD Backlighting
● Symbol Backlighting
● Front Panel Indicator

DESCRIPTION

Consequently as a result of the robust construction, product reliability is greatly improved. The HSMX-H670 adheres to the industry standard 2.0 x 1.25 mm footprint and is intended for designs where space is limited. The small size, low 1.
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