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HSMD-H690 - Surface Mount Flip Chip LEDs

Download the HSMD-H690 datasheet PDF. This datasheet also covers the HSMS-H690 variant, as both devices belong to the same surface mount flip chip leds family and are provided as variant models within a single manufacturer datasheet.

General Description

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs.

The internal flip chip construction eliminates the wire bond between the chip and printed circuit board.

Consequently as a result of the robust construction, product reliability is greatly improved.

Key Features

  • Improved Reliability Through Elimination of Internal Wire Bond.
  • -40 to 85°C Operating Temperature Range.
  • Small Size.
  • Industry Standard Footprint.
  • Diffused Optics.
  • Compatible with IR Solder Process.
  • Four Colors Available.
  • Available in 8 mm Tape on 7" (178 mm) Diameter Reels.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HSMS-H690-HP.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number HSMD-H690
Manufacturer HP
File Size 229.21 KB
Description Surface Mount Flip Chip LEDs
Datasheet download datasheet HSMD-H690 Datasheet

Other Datasheets by HP

Part Number Description
HSMD-H670 Surface Mount Flip Chip LEDs
HSMD-C650 Surface Mount Chip LEDs
HSMD-C670 Surface Mount Chip LEDs
HSMD-T400 Surface Mount LED Indicator
HSMD-T425 Surface Mount High Performance AlInGaP LED Indicators
HSMD-T500 Surface Mount LED Indicator
HSMD-T525 Surface Mount High Performance AlInGaP LED Indicators
HSMD-T600 Surface Mount LED Indicator
HSMD-T625 Surface Mount High Performance AlInGaP LED Indicators
HSMD-T700 Surface Mount LED Indicator

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
H Surface Mount Flip Chip LEDs Technical Data HSMX-H670 Series HSMX-H690 Series Features • Improved Reliability Through Elimination of Internal Wire Bond • -40 to 85°C Operating Temperature Range • Small Size • Industry Standard Footprint • Diffused Optics • Compatible with IR Solder Process • Four Colors Available • Available in 8 mm Tape on 7" (178 mm) Diameter Reels Applications • Keypad Backlighting • LCD Backlighting • Symbol Backlighting • Front Panel Indicator Description The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved.