HSME-T400 Key Features
- patible with Automatic Placement Equipment
- patible with Infrared and Vapor Phase Reflow Solder Processes
- Packaged in 12 mm or 8 mm tape on 7" or 13" Diameter Reels
- EIA Standard Package
- Low Package Profile
- Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes