HSMG-H670 Overview
The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved.
HSMG-H670 Key Features
- Improved Reliability Through Elimination of Internal Wire Bond
- 40 to 85°C Operating Temperature Range
- Small Size
- Industry Standard Footprint
- Diffused Optics
- patible with IR
- Four Colors Available
- Available in 8 mm Tape on 7"