Download the HSMG-H670 datasheet PDF.
This datasheet also covers the HSMS-H690 variant, as both devices belong to the same surface mount flip chip leds family and are provided as variant models within a single manufacturer datasheet.
General Description
The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs.
The internal flip chip construction eliminates the wire bond between the chip and printed circuit board.
Consequently as a result of the robust construction, product reliability is greatly improved.
Key Features
Improved Reliability Through Elimination of Internal Wire Bond.
-40 to 85°C Operating Temperature Range.
Small Size.
Industry Standard Footprint.
Diffused Optics.
Compatible with IR
Solder Process.
Four Colors Available.
Available in 8 mm Tape on 7"
(178 mm) Diameter Reels.
Full PDF Text Transcription for HSMG-H670 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
HSMG-H670. For precise diagrams, and layout, please refer to the original PDF.
H Surface Mount Flip Chip LEDs Technical Data HSMX-H670 Series HSMX-H690 Series Features • Improved Reliability Through Elimination of Internal Wire Bond • -40 to 85°C Op...
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Reliability Through Elimination of Internal Wire Bond • -40 to 85°C Operating Temperature Range • Small Size • Industry Standard Footprint • Diffused Optics • Compatible with IR Solder Process • Four Colors Available • Available in 8 mm Tape on 7" (178 mm) Diameter Reels Applications • Keypad Backlighting • LCD Backlighting • Symbol Backlighting • Front Panel Indicator Description The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, prod
HSMG-H670 Datasheet
