HSMS-T500 Overview
These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are patible with convective IR and vapor phase reflow soldering and conductive epoxy attachment processes.
HSMS-T500 Key Features
- patible with Automatic Placement Equipment
- patible with Infrared and Vapor Phase Reflow Solder Processes
- Packaged in 12 mm or 8 mm tape on 7" or 13" Diameter Reels
- EIA Standard Package
- Low Package Profile
- Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes