Hewlett-Packard MSA-0900
The MSA-0900 is a high performance silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) chip. This MMIC is designed for very wide bandwidth industrial and military applications that require flat gain and low VSWR. The value is the expected achievable performance for the MSA-0900 used with an external 45 pF capacitor mounted in a 100 mil stripline package.FEATURES
● Broadband, Minimum Ripple Cascadable 50 Ω Gain Block● 8.0 ± 0.2 dB Typical Gain Flatness from 0.1 to 4.0 GHz
● 3 dB Bandwidth: 0.1 to 6.0␣ GHz
● Low VSWR: ≤ 1.5:1 from 0.1 to 4.0␣ GHz
● 11.5 dBm Typical P1dB at 1.0␣ GHz The MSA-series is fabricated using HP’s 10 GHz fT, 25␣ GHz f MAX, silicon bipolar MMIC process which uses nitride self-alignment, ion implantation, and gold metallization to achieve excellent performance, uniformity and reliability. The use of an external bias resistor for temperature and current stability also allows bias flexibility. The recommended assembly procedure is gold-eutectic die attach at 400°C and either wedge or ball bonding using 0.7 mil gold wire. This chip is intended to be used with an external blocking capacitor completing the shunt feedback path (closed loop). Data sheet characterization is given for a 45␣ pF capacitor. Low frequency performance can be extended by using a larger valued capacitor.[1] Chip Outline[1]
DESCRIPTION
Note: 1. Refer to theAPPLICATIONS
section “Silicon MMIC Chip Use” for additional information.