SMF11CA
Key Features
- For surface mounted applications in order to optimize board space
- Glass passivated chip
- Low inductance
- Excellent clamping capability
- Typical ID less than 1µA at VWM
- 200 W peak pulse power capability with a 10/1000 µs waveform
- Case: JEDEC SOD-123FL molded plastic over passivated chip
- Terminals: Solder plated, solderable per MIL-STD-750 Method 2026
