S9979 Datasheet | Hamamatsu Corporation

Features Applications l TDI (Time Delay Integration) operation l 1536 (H) × 128 (V) pixel format l Pixel size: 48 × 48 µm l 100 % fill factor l Wide dynamic range: 20000 l Low dark signal: 2 ke-/pixel/s Typ. (MPP mode) l Low readout noise: 60 e-rms Typ. l MPP operation s Specification Type No. S9979 Cooling Non-cooled l Industrial inspection l Low-light-level detection Number of total pixels 1536 × 128 Number of active pixels 1536 × 128 Active area [mm (H) × mm(V)] 73.728 × 6.144 s General ratings Specification Full frame transfer or TDI 100 % 1536 (H) × 128 (V) 48 (H) × 48 (V) µm 73.728 (H) × 6.144 (V) mm 2 phase 2 phase Two-stage MOSFET source follower with load resistance 28-pin ceramic package Quartz window (standard) 1 Window - Temporarily attached window is available - 1: Temporary window type (ex. S9979N) and UV coat type (ex. S9979UV) are available upon request. Temporary window is fixed by tape to protect the CCD chip and wire bonding. Parameter CCD structure Fill factor Number of active pixels Pixel size CCD active area Vertical clock phase Horizontal clock phase Output circuit Package What is TDI operation In FFT-CCD, TDI operation performs continuous imaging of a fast-moving object, by transferring the signals at the same rate as the speed of the moving object. TDI operation allows acquiring continuous, clear images with high S/N and no frame breaks. Since signals of all pixels in each row are accumulated, sensitivity variations can be drastically improved pared to two-dimensional operation. q Signal integration by TDI operation SIGNAL TRANSFER - CHARGE CAPACITY OBJECT MOVEMENT Time1 Time2 Time3 1 line - - - - - M line KMPDC0139EA CCD area image sensor s Absolute maximum ratings (Ta=25 °C) Parameter .. Operating temperature Storage temperature OD voltage RD voltage ISV voltage IGV voltage IGH voltage SG voltage OG voltage RG voltage TG voltage Vertical clock voltage Horizontal clock voltage Symbol Topr Tstg VOD VRD VISV VIGV VIGH VSG VOG...