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Hi3670 - Application Processor

General Description

Alerts you to a potentially hazardous situation that could, if not avoided, result in equipment damage, data loss, performance deterioration, or unanticipated results.

Provides additional information to emphasize or supplement important points in the main text.

Key Features

  • are stipulated by the contract made between HiSilicon and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied. The information in this document is subject to change without notice. Ev.

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Datasheet Details

Part number Hi3670
Manufacturer HiSilicon
File Size 678.87 KB
Description Application Processor
Datasheet download datasheet Hi3670 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Hi3670 V100 Application Processor Data Sheet Issue Date 01 2018-03-02 Copyright © HiSilicon Technologies Co., Ltd. 2018. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of HiSilicon Technologies Co., Ltd. Trademarks and Permissions , , and other HiSilicon icons are trademarks of HiSilicon Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders. Notice The purchased products, services and features are stipulated by the contract made between HiSilicon and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope.