2SK1859 Datasheet | Hitachi Semiconductor

Features - - - - - Low on-resistance High speed switching Low Drive Current No secondary breakdown Suitable for Switching regulator Outline TO-3PFM 1. Gate 2. Drain 3. Source Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes 1. PW ≤ 10 µs, duty cycle ≤ 1 % 2. Value at Tc = 25 °C Symbol VDSS VGSS ID I D(pulse)- I DR Pch- Tch Tstg 2 1 Ratings 900 ±30 6 15 6 60 150 - 55 to +150 Unit V V A A A W °C °C Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Symbol V(BR)DSS V(BR)GSS I GSS Min 900 ±30 - - 2.0 - 2.3 - - - - - - - - - Typ - - - - - 2.0 3.7 980 400 195 20 80 125 100 0.9 1000 Max - - ±10 250 3.0 3.0 - - - - - - - - - - Unit V V µA µA V Ω S p F p F p F ns ns ns ns V ns I F = 6 A, VGS = 0 IF = 6 A, VGS = 0, di F / dt = 100 A / µs Test conditions I D = 10 m A, VGS = 0 I G = ±100 µA, VDS = 0 VGS = ±25 V, VDS = 0 VDS = 720 V, VGS = 0 I D = 1 m A, VDS = 10 V ID = 3 A VGS = 10 V- 1 ID = 3 A VDS = 20 V- 1 VDS = 10 V VGS = 0 f = 1 MHz ID = 3 A VGS = 10 V RL = 10 Ω Zero gate voltage drain current I DSS Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note 1. Pulse Test VGS(off) RDS(on) |yfs| Ciss Coss Crss t d(on) tr t d(off) tf VDF t rr See characteristic curves of 2SK1341 Power vs. Temperature Derating 90 Channel Dissipation Pch (W) 50 30 Drain Current I D (A) 10 3 1 0.3 0.1 0.05 0 50 100 150 1 3 10 30 100 300 1000 Case Temperature Tc (°C) Drain to Source Voltage VDS (V) Maximum Safe Operation Area PW 1...