2SK2075 Datasheet | Hitachi Semiconductor

Features - - - - - Low on-resistance High speed switching Low Drive Current No secondary breakdown Suitable for Switching regulator Outline TO-3P D G 1 2 3 1. Gate 2. Drain (Flange) 3. Source Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes 1. PW ≤ 10 µs, duty cycle ≤ 1 % 2. Value at Tc = 25°C Symbol VDSS VGSS ID I D(pulse)- I DR Pch- Tch Tstg 2 1 Ratings 250 ±30 20 80 20 100 150 - 55 to +150 Unit V V A A A W °C °C Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Symbol V(BR)DSS V(BR)GSS I GSS Min 250 ±30 - - 2.0 - 9 - - - - - - - - - Typ - - - - - 0.105 14 2400 970 145 30 110 220 95 1.3 330 Max - - ±10 250 3.0 0.13 - - - - - - - - - - Unit V V µA µA V Ω S p F p F p F ns ns ns ns V ns I F = 20 A, VGS = 0 I F = 20 A, VGS = 0, di F / dt = 100 A / µs Test conditions I D = 10 m A, VGS = 0 I G = ±100 µA, VDS = 0 VGS = ±25 V, VDS = 0 VDS = 200 V, VGS = 0 I D = 1 m A, VDS = 10 V I D = 10 A VGS = 10 V- 1 I D = 10 A VDS = 10 V- 1 VDS = 10 V VGS = 0 f = 1 MHz I D = 10 A VGS = 10 V RL = 3 Ω Zero gate voltage drain current I DSS Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note 1. Pulse Test VGS(off) RDS(on) |yfs| Ciss Coss Crss t d(on) tr t d(off) tf VDF t rr Power vs. Temperature Derating 160 Pch (W) I D (A) 100 30 10 3 1 0.3 Ta = 25 °C 0 0.1 50 100 150 Tc (°C) 200 1 Case Temperature 3 10 30 100 300 1000 Drain to Source Voltage V DS (V) Maximum Safe Operation Area 10 10 µ 0 µs s PW = 10 m s (1 Operation in sh this area is...