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H9TQ17ABJTMCUR-KTM - 16GB eNAND (x8) / LPDDR3 16Gb(x32)

Download the H9TQ17ABJTMCUR-KTM datasheet PDF. This datasheet also covers the H9TQ17ABJTMCUR variant, as both devices belong to the same 16gb enand (x8) / lpddr3 16gb(x32) family and are provided as variant models within a single manufacturer datasheet.

General Description

and is subject to change without notice.

for use of circuits described.

No patent licenses are implied.

Key Features

  • [ CI-MCP ].
  • Operation Temperature - (-25)oC ~ 85oC.
  • Package - 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR3 ].
  • eMMC5.0 compatible (Backward compatible to eMMC4.5).
  • Bus mode - Data bus width : 1 bit(default), 4 bits, 8 bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock frequency : 0~200MHz - MMC I/F Boot frequency : 0~52MHz.
  • Operating voltage range - Vcc (NAND) : 2.7 - 3.6V - Vccq (Controller) : 1.7.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (H9TQ17ABJTMCUR-HynixSemiconductor.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer

Other Datasheets by SK Hynix

Part Number Description
H9TQ17ABJTMCUR-KUM 16GB eNAND (x8) / LPDDR3 16Gb(x32)
H9TQ17ABJTMCUR 16GB eNAND (x8) / LPDDR3 16Gb(x32)
H9TKNNN8KDMPQR LPDDR2-S4B 8Gb
H9TP32A4GDBCPR 4GB eNAND (x8) / LPDDR2-S4B 4Gb(x32)

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.1 / Mar. 2014 1 Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) Document Title CI-MCP 16GB eNAND(x8) Flash / 16Gb (x32) LPDDR3 Revision History Revision No. 0.1 - Initial Draft History Draft Date Mar. 2014 Remark Preliminary Rev 0.1 / Mar. 2014 2 Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) FEATURES [ CI-MCP ] ● Operation Temperature - (-25)oC ~ 85oC ● Package - 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR3 ] • eMMC5.