Datasheet Summary
CI-MCP Specification
16GB eNAND (x8) + 16Gb LPDDR3 (x32)
This document is a general product description and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied.
Rev 0.1 / Mar. 2014
Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) Document Title CI-MCP 16GB eNAND(x8) Flash / 16Gb (x32) LPDDR3
Revision History
Revision No. 0.1
- Initial Draft
History
Draft Date Mar. 2014
Remark Preliminary
Rev 0.1 / Mar. 2014
Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32)
Features
[ CI-MCP ]
- Operation Temperature
- (-25)oC ~ 85oC
- Package
- 221-ball FBGA
-...