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H9TQ17ABJTMCUR Datasheet 16gb Enand (x8) / Lpddr3 16gb(x32)

Manufacturer: SK Hynix

Overview: CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general.

General Description

and is subject to change without notice.

SK hynix does not assume any responsibility for use of circuits described.

No patent licenses are implied.

Key Features

  • [ CI-MCP ].
  • Operation Temperature - (-25)oC ~ 85oC.
  • Package - 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR3 ].
  • eMMC5.0 compatible (Backward compatible to eMMC4.5).
  • Bus mode - Data bus width : 1 bit(default), 4 bits, 8 bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock frequency : 0~200MHz - MMC I/F Boot frequency : 0~52MHz.
  • Operating voltage range - Vcc (NAND) : 2.7 - 3.6V - Vccq (Controller) : 1.7.

More Datasheets from SK Hynix

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H9TKNNN8KDMPQR LPDDR2-S4B 8Gb
H9TP32A4GDBCPR 4GB eNAND (x8) / LPDDR2-S4B 4Gb(x32)

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