HY27US16561M
description of Device Operations
- /CE Don’t Care Enabled(Disabled) -> Sequential Row Read Disabled(Enabled) (Page23) 1) change FBGA dimension : Thickness : 1.2mm(max) -> 1.0mm(max) 2) Edit Fig.33 read operation with CE don't care 1) Change TSOP1,WSOP1,FBGA package dimension 0.6
- Change TSOP1,WSOP1,FBGA mechanical data
- Inches parameter has been excluded from the mechanical data table 1) Change TSOP1, WSOP1, FBGA package dimension 2) Edit TSOP1, WSOP1 package figures 3) Change FBGA package figure Oct. 18. 2004 Preliminary
History
Draft Date
Jul. 10. 2003 Dec. 08. 2003 Dec. 08. 2003
Remark
Preliminary Preliminary Preliminary
Mar. 08. 2004
Preliminary
Jun. 01. 2004
Preliminary
Sep. 24. 2004
Preliminary
Oct. 20. 2004
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.7 / Oct. 2004 1
HY27SS(08/16)561M Series...
