H27UBG8T2BTR-BC
Key Features
- Multi Level Cell(MLC) Technology
- NAND Interface - x8 bus width - Multiplexed address/ Data -Pin-out patibility for all densities
- Power Supply Voltage - VCC = 2.7 V ~ 3.6 V - VCCQ = 2.7 V ~ 3.6 V / 1.7 V ~ 1.95 V
- Organization - Page size : (8K+640spare)bytes - Block size : (2048K+160K)bytes - Plane size : 1024blocks - Device size : 2048blocks
- Block Erase -Block Erase Time: 3.5ms(Typ.)
- mand Set - ONFI 2.2 pliant mand Set - Interleaved Copyback Program - Read Unique IDs
- Package - Package type : TSOP - Chip count : SDP(1CE, Single) = 1stack DDP(2CE, Dual) = 2stack - Pin Count : 48 - Size : 12mm x 20mm x 1.2mm
- Chip Enable Don’t Care - Simple interface with microcontroller
- Hardware Data Protection - Program/Erase locked during Power transitions
