MBRF20200CT
Key Features
- Guard -Ring for Stress Protection
- Low Forward Voltage
- High Operating Junction Temperature
- Low Power Loss/High Efficiency
- High surge capability
- 100% avalanche tested
- Minimum Lot-to-Lot variations for robust device
- Case: Epoxy, Molded
- Finish: All External Surfaces Corrosion Resistant and
- Lead Temperature for Soldering Purposes: 260℃ Max