Description
Assembly Die Process ANALYSIS RESULTS I Assembly ANALYSIS RESULTS II Die Process TABLES Procedure Overall Quality Evaluation Package Markings Wirebond Strength Die Material Analysis Horizontal Dimensions Vertical Dimensions
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-iFree Datasheet http://www.Da
Features
- Twin-well CMOS process in an N substrate (no epi).
- Sub-micron gate lengths (0.35 micron N-channel and 0.4 micron P-channel).
- Tungsten plugs used under all metal layers. 1These items present possible quality or reliability concerns. They should be discussed with the manufacturer to determine their possible impact on the intended.
PZ5032-10A44 Datasheet
