FEATURES
O IRF3305 HEXFET® Power MOSFET D O O O O Designed to support Linear Gate Drive APPLICATIONS
175°C Operating Temperature Low Thermal Resistance Junction - Case Rugged Process Technology and Design Fully Avalanche Rated VDSS = 55V RDS(on) = 8.0mΩ DESCRIPTION
Specifically designed for use in linear automotive applications this HEXFET Power MOSFET utilizes a rugged planar process technology and device design, which greatly improves the Safe Operating Area (SOA) of the device. These features, coupled with 175°C junction operating temperature and low thermal resistance of 0.45C/W make G S ID = 75A ABSOLUTE MAXIMUM RATINGS
Parameter ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) ID @ TC = 100°C Continuous Drain Current, VGS @ 10V ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited) Pulsed Drain Current IDM TO-220AB Max. 140 99 75 560 330 2.2 ± 20 W W/°C V mJ A mJ -55 to + 175 °C 300 (1.6mm from case ) 10 lbf in (1.1N m) A Units PD @TC = 25°C Po...
International Rectifier
