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IRF6100PBF Datasheet PDF

International Rectifier IRF6100PBF

HEXFET Power MOSFET

Part No. IRF6100PBF
Datasheet IRF6100PBF Download
Manufacturer
International Rectifier
Description HEXFET Power MOSFET
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IRF6100PBF datasheet page 1 preview

DESCRIPTION

True chip-scale packaging is available from International Rectifier. Through the use of advanced processing techniques, and a unique packaging concept, extremely low on-resistance and the highest power densities in the industry have been made available for battery and load management applications. These benefits, combined with the ruggedized device design , that International Rectifier is well known for, provides the designer with an ex- D G S FlipFET™ ISOMETRIC tremely efficient and reliable device. The FlipFET™ package, is one-third the footprint of a comparable SOT-23 package and has a profile of less than .8mm. Combined with the low thermal resistance of the die level device, this makes the FlipFET™ the best device for application where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, cell phones and PCMCIA cards.

ABSOLUTE MAXIMUM RATINGS

Parameter VDS ID @ TA = 25°C ID @ TA = 70°C IDM PD @TA = 25°C PD @TA...
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