IRF6156 Datasheet PDF

DESCRIPTION

True chip-scale packaging is available from International Rectifier. Through the use of advanced processing techniques and a unique packaging concept, extremely low on-resistance and the highest power densities in the industry have been made available for battery and load management applications. These benefits, combined with the ruggedized device design that International Rectifier is well known for, provide the designer with an extremely efficient and reliable device. The FlipFET™ package, is one-fifth the footprint of a comparable TSSOP-8 package and has a profile of less than .8mm. Combined with the low thermal resistance of the die level device, this makes the FlipFET™ the best device for applications where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, mobile phones and PCMCIA cards. PD - 94592B IRF6156 FlipFET™ Power MOSFET RSS(on) max : 40m @VGS1,2 = 4.5V : 60m @VGS1,2 = 2.5V IS ±6.5 ±5.2 Absolute Ma...