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IRFRU3910 Datasheet PDF

International Rectifier IRFRU3910

This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.
Part No. IRFRU3910
Datasheet IRFRU3910 Download
Manufacturer
International Rectifier
Description HEXFET Power MOSFET
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IRFRU3910 datasheet page 1 preview

DESCRIPTION

l D VDSS = 100V G S RDS(on) = 0.115Ω ID = 16A Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. The straight lead version (IRFU series) is for throughhole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications. D -P A K T O -252 A A I-P A K T O -25 1A A

ABSOLUTE MAXIMUM RATINGS

Parameter ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current † Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy‚† Avalanche Current† Repetitive Avalanche Energy† Peak Diode Recovery dv/dt ƒ Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Max. 16 12 60 79 0.53 ± 20 150 9.0 7.9 5.0 -55 to + 175 300 (1.6mm from case ) Units A W W/°C V m...
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