Datasheet4U Logo Datasheet4U.com

IXGA7N60BD1 - HiPerFAST IGBT

Datasheet Summary

Features

  • G = Gate, E = Emitter, C = Collector, TAB = Collector Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md www. DataSheet4U. net.
  • International standard packages 0.45/4 Nm/lb. in. 0.55/5 Nm/lb. in. 4 2 g g JEDEC TO-263 surface mountable and JEDEC TO-220 AB.
  • High current handling capability.
  • HiPerFASTTM.

📥 Download Datasheet

Datasheet preview – IXGA7N60BD1

Datasheet Details

Part number IXGA7N60BD1
Manufacturer IXYS Corporation
File Size 99.75 KB
Description HiPerFAST IGBT
Datasheet download datasheet IXGA7N60BD1 Datasheet
Additional preview pages of the IXGA7N60BD1 datasheet.

📁 Similar Datasheet

Other Datasheets by IXYS Corporation

Full PDF Text Transcription

Click to expand full text
Advanced Technical Information HiPerFASTTM IGBT with Diode IXGA 7N60BD1 IXGP 7N60BD1 VCES IC25 VCE(sat) tfi = 600 V = 14 A = 2.0 V = 150ns Symbol VCES VCGR VGES VGEM IC25 IC90 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25°C TC = 90°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 18 Ω Clamped inductive load @ 0.8 VCES TC = 25°C Maximum Ratings 600 600 ±20 ±30 14 7 56 ICM = 14 80 -55 ... +150 150 -55 ... +150 300 M3 M3.5 V V V V A A A A G E C (TAB) G C E TO-220AB (IXGP) TO-263 AA (IXGA) W °C °C °C °C Features G = Gate, E = Emitter, C = Collector, TAB = Collector Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Md www.DataSheet4U.net • International standard packages 0.
Published: |