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IXGR50N60BD1 - HiPerFAST IGBT ISOPLUS247

This page provides the datasheet information for the IXGR50N60BD1, a member of the IXGR50N60B HiPerFAST IGBT ISOPLUS247 family.

Features

  • z z z z Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s VISOL Weight Symbol Test Conditions 50/60 Hz, RMS, t = 1minute leads-to-tab z DCB Isolated mounting tab Meets TO-247AD package Outline High current handling capability Latest generation.

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www.DataSheet4U.com HiPerFASTTM IGBT ISOPLUS247TM VCES IXGR 50N60B IXGR 50N60BD1 IC25 VCE(sat) (Electrically Isolated Back Surface) tfi(typ) = 600 V = 75 A = 2.5 V = 85 ns (D1) Symbol VCES VCGR VGES VGEM IC25 IC110 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25°C TC = 110°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 10 Ω Clamped inductive load, L = 100 µH TC = 25°C Maximum Ratings 600 600 ± 20 ± 30 75 45 200 ICM = 100 @ 0.8 VCES 250 -55 ... +150 150 -55 ... +150 300 2500 5 V V V V A A A A W °C °C °C °C V g ISOPLUS 247 E153432 G C E Isolated Backside* G = Gate, E = Emitter C = Collector * Patent pending Features z z z z Maximum lead temperature for soldering 1.6 mm (0.062 in.
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