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IXTC13N50 - Power MOSFET

Key Features

  • D = Drain z Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation z Lowdraintotabcapacitance(.

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Power MOSFET ISOPLUS220TM IXTC 13N50 Electrically Isolated Back Surface N-Channel Enhancement Mode High dv/dt, Low trr, HDMOSTM Family VDSS = 500 V ID25 = 12 A RDS(on) = 0.4 Ω Preliminary Data Sheet Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR dv/dt PD TJ TJM Tstg TL Weight Symbol VDSS VGS(th) IGSS IDSS ISOPLUS220TM Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGS = 1 MΩ E Continuous Transient T TC = 25°C TC = 25°C, pulse width limited by TJM TC = 25°C E TC = 25°C IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS, L TJ ≤ 150°C, RG = 2 Ω TC = 25°C SO 1.6 mm (0.062 in.) from case for 10 s Maximum Ratings 500 V 500 V ±20 V ±30 V 12 A 48 A 13 A 18 mJ 5 V/ns 140 W -55 ... +150 °C 150 °C -55 ...