IXTH50P085 Overview
+150 V V V V A A A mJ W °C °C °C °C TO-247 AD D (TAB) G = Gate, S = Source, D = Drain, TAB = Drain Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Mounting torque 300.
IXTH50P085 Key Features
- International standard package JEDEC TO-247 AD
- Low RDS (on) HDMOSTM process
- Rugged polysilicon gate cell structure Unclamped Inductive Switching (UIS) rated Low package inductance (<5 nH)
- easy to drive and to protect
- VDSS V GS = 0 V VGS = -10 V, ID = 0.5
