FMM50-025TF
Key Features
- z Silicon Chip on Direct-Copper Bond (DCB) Substrate - UL Recognized Package - Isolated Mounting Surface - 2500V Electrical Isolation
- Avalanche Rated
- Low Drain-to-Tab capacitance
- Low package inductance Advantages
- Low Gate Drive RRequirement
- High power density
- Fast Intrinsic Rectifier
- Low Drain to Ground Capacitance
- Fast Switching
Applications
- Pulse test, t ≤ 300μs, duty cycle, d ≤ 2 %
