FMM60-02TF
Key Features
- z Silicon chip on Direct-Copper Bond (DCB) substrate - UL recognized package - Isolated mounting surface - 2500V electrical isolation
- Avalanche rated
- Low Drain-to-Tab capacitance
- Low package inductance Advantages
- Low gate drive requirement
- High power density
- Fast intrinsic rectifier
- Low drain to ground capacitance
- Fast switching
