FMP26-02P
Key Features
- z Silicon Chip on Direct-Copper Bond (DCB) Substrate - UL Recognized Package - Isolated Mounting Surface - 2500V~ Electrical Isolation
- Avalanche Rated
- Low Drain-to-Tab Capacitance
- Low Package Inductance Advantages
- Low Gate Drive Requirement
- High Power Density
- Low Drain to Ground Capacitance
- Fast Switching
Applications
- 200
