IX150T06M-AG Description
Trench XPT IGBT Chip IX150T06M-AG tentative Type VCE [V] IX150T06M-AG 650 IC Chip Size Package [A] [mm] x [mm] 300 14.2 10.6 sawn on foil unsawn wafer in waffle pack Ordering Code tbd tbd tbd.
IX150T06M-AG Key Features
- Easy paralleling due to the positive temperature coefficient of the on-state voltage
- short circuit rated for 10 µsec
- very low gate charge
- square RBSOA @ 2x Ic
- low EMI
- Tvjm = 175°C
- Thin wafer technology bined with the XPT design results in a petitive low Vce(sat)
- Solderable/sinterable frontside metallization for highly reliable interconnection technology