IXBF32N300 Overview
Key Specifications
Mount Type: Through Hole
Max Operating Temp: 150 °C
Min Operating Temp: -55 °C
Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Mounting Surface
- 3000V Electrical Isolation
- High Blocking Voltage
- International Standard Package
- Low Conduction Losses Advantages
- Low Gate Drive Requirement
- High Power Density
