Overview: X3-Class HiPerFETTM Power MOSFET
N-Channel Enhancement Mode Avalanche Rated IXFA130N15X3
D G
S Symbol
VDSS VDGR
VGSS VGSM
ID25 IL(RMS) IDM
IA EAS
dv/dt
PD
TJ TJM Tstg
TL dT/dt TSOLD
FC Weight Test Conditions TJ = 25C to 150C TJ = 25C to 150C, RGS = 1M Continuous Transient Maximum Ratings 150 V 150 V 20 V 30 V TC = 25C (Chip Capability) External Lead Current Limit TC = 25C, Pulse Width Limited by TJM
TC = 25C TC = 25C
IS IDM, VDD VDSS, TJ 150°C
TC = 25C 130 120 230
65 1.2
50
390
-55 ... +150 150
-55 ... +150 A A A
A J
V/ns
W
C C C Maximum Lead Temperature for Soldering Heating / Cooling rate, 175C - 210C
1.6 mm (0.062in.) from Case for 10s 300 °C 50 °C/min 260 °C Mounting Force 10..65 / 2.2..14.6 N/lb 2.5 g Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) BVDSS VGS = 0V, ID = 250μA VGS(th) VDS = VGS, ID = 1.5mA IGSS VGS = 20V, VDS = 0V IDSS VDS = VDSS, VGS = 0V TJ = 125C RDS(on) VGS = 10V, ID = 0.5 • ID25, Notes 1 & 2 Characteristic Values Min. Typ. Max. 150 V 2.5 4.
