IXFP8N85X Datasheet PDF

MAXIMUM RATINGS

850 V 850 V 30 V 40 V TC = 25C TC = 25C, Pulse Width Limited by TJM TC = 25C TC = 25C IS  IDM, VDD  VDSS, TJ  150°C TC = 25C 8 16 4 300 50 200 -55 ... +150 150 -55 ... +150 A A A mJ V/ns W C C C Maximum Lead Temperature for Soldering 300 °C 1.6 mm (0.062in.) from Case for 10s 260 °C Mounting Force (TO-263HV) Mounting Torque (TO-220 & TO-3P) 10..65 / 2.2..14.6 1.13 / 10 N/lb Nm/lb.in TO-263HV TO-220 TO-3P 2.5 g 3.0 g 5.5 g Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) BVDSS VGS = 0V, ID = 250μA VGS(th) VDS = VGS, ID = 250μA IGSS VGS = 30V, VDS = 0V IDSS VDS = VDSS, VGS = 0V TJ = 125C RDS(on) VGS = 10V, ID = 4A, Note 1 Characteristic Values Min. Typ. Max. 850 V 3.0 5.5 V 100 nA 10 A 750 A 850 m G S TO-220 (IXFP) D (Tab) G DS TO-3P (IXFQ) D (Tab) G D S D (Tab) G = Gate D = Drain S = Source Tab = Drain

FEATURES

● International Standard Packages
● High Voltage Package
● Low RDS(ON) and QG
● Avalanche Rated
● Low Packa...