IXYS IXGH24N60CD1
HiPerFAST IGBT
MAXIMUM RATINGS
600 600 ±20 ±30 48 24 80 ICM = 48 @ 0.8 VCES 150 -55 ... +150 150 -55 ... +150 300 V V V V A A A A TO-268 (IXGT) G E C (TAB) VGES VGEM IC25 IC110 ICM SSOA (RBSOA) PC TJ TJM Tstg TO-247 AD (IXGH) C (TAB) G C E C = Collector, TAB = Collector W °C °C °C °C G = Gate, E = Emitter, Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Md Weight Mounting torque (M3) TO-247 TO-268 1.13/10 Nm/lb.in. 6 4 g g Symbol Test Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 600 2.5 TJ = 25°C TJ = 150°C 5.5 200 3 ±100 2.1 2.5 V V mA mA nA VFEATURES
● International standard packages JEDEC TO-247 and surface mountable TO-268● High frequency IGBT
● High current handling capability
● Latest generation HDMOSTM process
● MOS Gate turn-on - drive simplicity
● Fast recovery expitaxial Diode (FRED) - soft recovery with low IRM
APPLICATIONS
● PFC circuits● Uninterruptible power supplies (UPS)
● Switched-mode and resonant-mode power...