IXGR72N60B3H1 Overview
Key Specifications
Mount Type: Through Hole
Max Operating Temp: 150 °C
Min Operating Temp: -55 °C
Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Mounting Surface Optimized for Low Conduction and Switching Losses
- 2500V~ Electrical Isolation
- Square RBSOA
- Anti-Parallel Ultra Fast Diode Advantages
- High Power Density
