MIXA600CF650TSF Overview
Key Features
- High level of integration
- only one power semiconductor module required for the whole drive
- Rugged XPT design (Xtreme light Punch Through) results in
- short circuit rated for 10 µsec
- very low gate charge
- square RBSOA @ 3x Ic
- Thin wafer technology combined with the XPT design results in a competitive low VCE(sat)
- Temperature sense included
- SONIC™ diode
- fast and soft reverse recovery
