MMIX1X200N60B3H1 Overview
Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Mounting Surface z 2500V~ Electrical Isolation
- Optimized for Low Conduction and Switching Losses
- Avalanche Rated
- Short Circuit Capability
- Very High Current Capability
- Square RBSOA Advantages
- High Power Density
- Low Gate Drive Requirement
