MMIX1Y25N250CV1 Overview
Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Heatsink Surface
- 2500V~ Electrical Isolation
- Anti-Parallel Diode
- High Power Density
- Low Gate Drive Requirement
| Part | MMIX1Y25N250CV1 |
|---|---|
| Description | High Voltage IGBT |
| Manufacturer | IXYS |
| Size | 261.00 KB |
Related Datasheets
| Part Number | Manufacturer | Description |
|---|---|---|
| SLIMDIP-L | Mitsubishi Electric | DIPIPM RC-IGBT inverter bridge |
| SLIMDIP-S | Mitsubishi Electric | DIPIPM RC-IGBT inverter bridge |
| SP25N135T | Xiner | Trench-FS IGBT |