package: - high level of integration - high current capability - aux. terminals for MOSFET gate control - terminals for soldering or welding
connections - isolated DCB ceramic base plate
with optimized heat transfer.
The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
Three phase full Bridge
with Trench MOSFETs in DCB isolated high current package
MTI200WX75GD
VDSS = 75 V ID25 = 255 A RDSon typ. = 1.1 mW
Part number MTI200WX75GD
T1 G1
S1
T2 G2
S2
L1+ T3
G3
S3
L1 T4
G4
S4
L1-
L2+ T5
G5
S5
L2 T6
G6
S6 L2-
L3+ Surface Mount Device
L3
L3-
Features / Advantages:
• MOSFETs in trench technology: - low RDSon - optimized intrinsic reverse diode • package: - high level of integration - high current capability - aux.