XBB170 Description
XBB170 is.
XBB170 Key Features
- 3750Vrms Input/Output Isolation
- Low Drive Power Requirements (TTL/CMOS
- High Reliability
- Arc-Free With No Snubbing Circuits
- FCC patible
- VDE patible
- No EMI/RFI Generation
- Small 8-Pin Package
- Machine Insertable, Wave Solderable
- Surface Mount, Tape & Reel Version Available