MUR850
Key Features
- Ultrafast Recovery Time
- Low Forward Voltage
- Low Leakage Current
- 175℃ Operating Junction Temperature
- High Temperature Glass Passivated Junction
- Minimum Lot-to-Lot variations for robust device
- Case: Epoxy, Molded
- Finish: All External Surfaces Corrosion Resistant and
- Lead Temperature for Soldering Purposes: 260℃ Max
Applications
- Designed for use in switching power supplies, inverters and as
