SIPC42S2N08 Description
Assembly by epoxy die bonding or soldering AQL 1.5 for visual inspection according to failure catalog A67207-A7001-A001 issue C on 100% measured wafer Storage of chips and wafer according technical guideline 14 Doc. +175 Unit A mJ mJ V Ω °C Avalanche energy, single pulse1) ID =80A, VDD =25V, RGS =25Ω Repetitive avalanche energy, limited by Tjmax 1)2) EAR Gate source voltage VGS Additional gate resistance Operating...