SIPC42S2N08 - OptiMOS Chip data sheet

Datasheet Summary

Description

Assembly by epoxy die bonding or soldering AQL 1.5 for visual inspection according to failure catalog A67207-A7001-A001 issue C on 100% measured wafer

Storage of chips and wafer according technical guideline 14 Doc.

No.

Infineon Technologies AG

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Datasheet Details

Part number	SIPC42S2N08
Manufacturer	Infineon Technologies AG
File Size	90.37 KB
Description	OptiMOS Chip data sheet
Datasheet	SIPC42S2N08 Datasheet
Additional preview pages of the SIPC42S2N08 datasheet.

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Preliminary data OptiMOSâ Chip data sheet SIPC42S2N08 Feature • N-Channel • Enhancement mode • 175°C operating temperature • Avalanche rated • dv/dt rated • Integrated gate resistance for easy parallel connection Ordering Code unsawn wafer on foil sawn wafer on foil surf tape DESCRIPTION • Assembly by epoxy die bonding or soldering • AQL 1.5 for visual inspection according to failure catalog A67207-A7001-A001 issue C on 100% measured wafer • Storage of chips and wafer according technical guideline 14 Doc. No. A66003-R14-T1-B-35 VDS RDS(on) Die size Thickness 75 4.2 7x6 175 V mΩ mm2 µm on request Q67061-S7146 on request Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Continuous drain current 1)2) TC=25°C Symbol ID EAS Value 227 1070 50 ±20 5 ±20% -55...

Published: Apr 8, 2005 |