LGM470
Overview
- package: white SMT package
- feature of the device: extremely wide viewing angle; LED is mounted top down and emits through the PCB; ideal for backlighting and coupling in light guides
- wavelength: 570 nm
- viewing angle: Lambertian Emitter (120°)
- technology: GaP
- optical efficiency: 2.5 lm/W
- grouping parameter: luminous intensity
- assembly methods: suitable for all SMT assembly methods
- soldering methods: IR reflow soldering
- preconditioning: acc. to JEDEC Level 2
