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Preliminary
SIDC81D120E6
Fast switching diode chip in EMCON-Technology
FEATURES: • 1200V EMCON technology 130 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient
A
This chip is used for: • EUPEC power modules and discrete devices Applications: • SMPS, resonant applications, drives
C
Chip Type
SIDC81D120E6
VR
IF
Die Size 9 x 9 mm2
Package sawn on foil
Ordering Code Q67050-A4128A001
1200V 100A
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallisation Cathode metallisation Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 9x9 81 / 69.39 8.28 x 8.
SIDC81D120E6 Datasheet
