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SIGC04T60
IGBT Chip
FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
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This chip is used for: • power module • discrete components Applications: • drives • white goods • resonant applications
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Chip Type SIGC04T60
VCE 600V
ICn 6A
Die Size 1.98 x 1.96 mm2
Package sawn on foil
Ordering Code Q67050A4330-A101
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Recommended storage environment 1.98 x 1.96 1.254 x 1.273 0.266 x 0.266 3.9 / 2.
SIGC04T60 Datasheet
