Click to expand full text
www.DataSheet4U.com
SIGC04T60G
IGBT Chip
FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
3
This chip is used for: • power module • discrete components Applications: • drives • white goods • resonant applications
C
G
E
Chip Type SIGC04T60G
VCE 600V
ICn 6A
Die Size 1.89 x 2.17 mm2
Package sawn on foil
Ordering Code Q67050A4346-A101
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Recommended storage environment 1.89 x 2.17 1.007 x 1.33 0.361 x 0.513 4.1 / 2.
SIGC04T60G Datasheet
