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SIGC06T60
IGBT Chip
FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
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This chip is used for: • power module • discrete components Applications: • drives • white goods • resonant applications
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Chip Type SIGC06T60
VCE 600V
ICn 10A
Die Size 2.42 x 2.38 mm2
Package sawn on foil
Ordering Code Q67050A4331-A101
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Recommended storage environment 2.42 x 2.38 1.672 x 1.691 0.266 x 0.266 5.8 / 3.
SIGC06T60 Datasheet
