SIGC08T60 Datasheet | Infineon

.. IGBT Chip Features : - 600V Trench & Field Stop technology - low VCE(sat) - low turn-off losses - short tail current - positive temperature coefficient - easy paralleling This chip is used for: - power module - discrete ponents Applications: - drives - white goods - resonant applications Chip Type SIGC08T60 VCE 600V ICn 15A Die Size 2.86 x 2.82 mm2 Package sawn on foil Ordering Code Q67050A4282-A101 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject...